Soldering related equipment and materials HAKKO 375

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  • Optimal for minimizing solder and flux splash
    Solder feeding equipment with V-grooving function for superior cost performance
    Minimize solder and flux splash
    As shown below, when solder is cut with a V-groove it enables the release of gas pressure generated by the flux, thereby suppressing splash. However, because the V-groove exposes the flux to outside air the solder cannot be stored for a long period of time. 
    When using solder with the HAKKO 375, you can groove the solder that you require. 
    Minimize solder and flux splash 

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    You can browse and download "Instruction Manuals" and "MSDS (SDS)" freely.
    Even "Engineering Documents"are available once you complete user registration.

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    Advantages of V-grooved solder
      -Examination of solder/flux splash
      Examination of solder/flux splash
    Test criteria
    Measurement method Measure the amount of solder and flux splashing after solder is fed to the soldering iron.
    Temperature setting for soldering iron 350ºC and 400ºC
    Solder Lead-free (Sn-3Ag-0.5Cu)
    Halogen-free flux
    ø0.3 mm and ø1.0 mm
    Solder feed length 50 mm

    *The effect of solder and flux splashing prevention may differ under different operation conditions.

      -Measurement graph of flux splash amount


    *Click here to enlarge


    *Click here to enlarge
    Applicable solder dia.
    ø0.3, ø0.5, ø0.6, ø0.8, ø1.0(mm)
    Compact design


    Can be applicable with the conventional solder reel stand.
    (Can be applicable with the HAKKO 611)
    -Application Examples
    Can be applicable with the conventional solder reel stand.
    Use an option switch to increase efficiency
    Control the amount of solder that is fed using the ON/OFF switch. Use an option switch or hand switch to increase functionality even more.